The SME series deposition system is capable of handling up to 200mm substrate size and is available in several configurations from single to six process chambers.
The SRH PVD system is designed specifically to handle thin wafers and deposit films for UBM and other applications.
ULDiS series PVD system for production of optical filters and coatings.
The ULVAC SMV-500F sputtering system is used for seed layer (Ti/Cu) PCB interposers.
The SPW roll coater series is perfect for depositing multilayer films on rolls up to 1.65 meters in width.
Vertical Deposition results in low particle generation.
Drum type sputtering system.
The Entron-EX multi-chamber sputtering system is specifically designed for the 300mm Semiconductor market.
Multi-chamber Sputtering System ENTRONTM-EX2 W300 is latest 300mm PVD platform capable of running the most advanced Semiconductor processes.
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