Advanced plasma resist strip system specifically designed for non-300mm fabs. Equipped with a versatile platform that can handle the complete line of wafer sizes from 4" to 8"
Dual Chamber Ashing system capable of running two wafer sizes simultaneously from 100mm to 300mm.
The ENVIRO-Optima resist strip system provides the highest throughput per m2 of clean-room space at the lowest cost.
Luminous NA series ashing systems can be used for all sizes of wafers and is compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
The NA-1300 ashing system can be used for 200 and 300mm wafers and is compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
Plasma ashing system for FO-PLP. Designed to handle large substrates.
