The ENVIRO-Optima resist strip system provides the highest throughput per m2 of clean-room space at the lowest cost.
Plasma ashing system for FO-PLP. Designed to handle large substrates.
Luminous NA series ashing systems can be used for all sizes of wafers and is compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
The SME series deposition system is capable of handling up to 200mm substrate size and is available in several configurations from single to six process chambers.
The ULVAC SMV-500F sputtering system is used for seed layer (Ti/Cu) PCB interposers.
The SRH PVD system is designed specifically to handle thin wafers and deposit films for UBM and other applications.
Drum type sputtering system.
Vertical Deposition results in low particle generation.