Don't Sacrifice Production for Floorspace
Combined with fast new wafer handling robotics, ENVIRO-Optima's straightforward design results in the highest throughput with the smallest footprint (67wph/m2) for systems under $1 million.
ENVIRO Offers the Flexibility for Multiple Applications
- Descum
- Thick resist strip (including: SU-8, KMPR, silanated)
- Polymer and residue removal
- MEMS Release (organic sacrificial layer removal)
- Backside clean (bevel/edge)
ENVIRO Offers a Wide Process Operating Range
- Ashing Rate – Several nm/min to more than 10um/min
- Wide range of stage temperature control (hot plate or optional cold plate)
- High efficiency downstream plasma source
- Up to 4 MFC’s, 2 standard, 2 optional
- Gas chemistries: various, including halogen bearing
Plasma Source Options
 MW Downstream Plasma Source |
 Remote ICP Plasma Source |
SEM Images
