ENVIRO-1Xa 2C

The Perfect Dual-Chamber Ashing System

The system can process 100mm – 300mm wafer sizes. The versatile platform provides the ability to run two different wafer sizes simultaneously, in dedicated process chambers. Each chamber features a high efficiency downstream plasma source, with a high speed Photoresist removal, > 10 µm/min ashing rates, with repeatability and reliability. The compact design of the two-chamber system provides high throughput, low cost, and low Cost of Ownership

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ENVIRO-1Xa 2C (Dual Process Chambers)

115 WPH (20 sec process time)
100 – 300 mm wafer size with ability to run 2 different sizes simultaneously in dedicated chambers
Non-contact end effector option
HEPA option
Dual cassette loading:
SMIF option
FOUP option