Advanced plasma resist strip system specifically designed for non-300mm fabs. Equipped with a versatile platform that can handle the complete line of wafer sizes from 4" to 8"
NE-550EXa is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.
Dry etching system for high volume production with good cost performance and wide selection of tool configuration.
The SME series deposition system is capable of handling up to 200mm substrate size and is available in several configurations from single to six process chambers.
CS-200The CS-200 is a compact load-lock type sputtering system. suitable for research & development and for small and medium-scale production.
Need More Information?