Dual Chamber Ashing system capable of running two wafer sizes simultaneously from 100mm to 300mm.
The ENVIRO-Optima resist strip system provides the highest throughput per m2 of clean-room space at the lowest cost.
NE-550EXa is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.
The SME series deposition system is capable of handling up to 200mm substrate size and is available in several configurations from single to six process chambers.
The SRH PVD system is designed specifically to handle thin wafers and deposit films for UBM and other applications.
Batch-Type high vacuum evaporation system.
Ion Implanter for mass production with high temp ESC for SiC.
The CC-200/400 is a compact and easy to use CVD system designed for R&D and Production environments.
CME-200E/400 is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.