Key Features
- Based on ULVAC’s process data and years of experience, the CS-200 system was designed based on user-friendly operation and cost down.
- The process chamber can be kept under vacuum during substrate transfer via a load lock chamber.
- The Load lock chamber is equipped with a substrate handler that transfers the substrate to and from the operator.
- Maximum substrate transfer size is φ 300 mm
- Multiple cathode / co-sputtering capability available.
- Preclean available in process chamber via RF bias
- Both deposition up or down are available.
Need more information?
At ULVAC, we understand that finding the right product is crucial for optimizing your processes, whether you're scaling up production or maintaining precision in your systems. With our wide range of cutting-edge vacuum technologies and in-depth expertise, we will guide you through selecting the ideal solution tailored to your unique requirements.
Contact ULVAC System Sales & Support For inquiries outside North and South America, please contact ULVAC Corporate