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ENVIRO-1Xa
Advanced plasma resist strip system specifically designed for non-300mm fabs. Equipped with a versatile platform that can handle the complete line of wafer sizes from 4" to 8"
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ENVIRO-1Xa 2C
Dual Chamber Ashing system capable of running two wafer sizes simultaneously from 100mm to 300mm.
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NE-550EXa
NE-550EXa is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.
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NE-5700
Dry etching system for high volume production with good cost performance and wide selection of tool configuration.
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NLD-570EXa
Industry Leading Deep Oxide Etching
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SME Series
The SME series deposition system is capable of handling up to 200mm substrate size and is available in several configurations from single to six process chambers.
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CS-200
The CS-200 is a compact load-lock type sputtering system. suitable for research & development and for small and medium-scale production. -
Ei-5
Batch-Type high vacuum evaporation system.
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CC Series
The CC-200/400 is a compact and easy to use CVD system designed for R&D and Production environments.
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CME Series
CME-200E/400 is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.
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