Key Features
- High-density plasma process with high-frequency(27.12 MHz) power supply
- High-quality film using SiH4 precursor: SiO2, SiNx, SiON, a-Si, also for TEOS process for SiO2 film
- Chamber Cleaning with NF3+Ar plasma
- Supports the heater for low-temperature deposition of organic EL
- Substrate size up to 200 x 200mm for CME-200E, Max. 300 x 400mm for CME-400