Batch Etching at It's Finest
ULVAC's RISE system offers damage-free etching with a low-temperature process option.
Key Metrics
- Damage-free (remote plasma and low-temperature process)
- High throughput and low CoO
- Processing in batches of fifty wafers
- Superior etching uniformity (5% or less per batch)
- Easy maintenance (no side maintenance access is required)
- Small foot print compared to cluster type equipment
- 50% lower self-aligned contact resistance compared to current wet process
- The smallest foot print