Description
The NA-1500 is the perfect tool for large FO-PLP applications and capable of removing resist, plasma cleaning, and surface modification (hydrophobicity to hydrophilicity). With key features such as a high removal rate (greater than 1.5 um/min) for photoresist and a low temperature process capabilities this is an excellent tool for panel level packaging solutions.
Applications
- Normal Ashing (Resist, polyimide)
- Residue Removal
- Organic Film Etching
- Plasma Cleaning
- Surface Modification
Key Features
- 2 process modules, 2 cassettes, Atmospheric robot
- Square Substrate size ~500mm (larger sizes avaialable)
- Low temperature process - <140C
- High Ashing Rate - >1.5um/min (photoresist)
- Uniformity - <+/- 10% (edge exclusion 10mm)
