Drum Type Sputtering System
In recent years, smart phones and tablets using SAW devices have risen considerably. Electromagnetic noise generated from interconnect of power supply, system on chip, memory, etc. can interfere with RF devices and deteriorate its performance. In the past, metal plates have been used as a popular method to eliminate interference, however, as chip size and devices become smaller and more sophisticated, the technical trend is moving towards depositing EMI (Electromagnetic Interference) Shield by sputtering. This is becoming a more critical technology as the number of signal bands and devices increases in a single package.
Key Features
- Small Footrpint
- Low temperature process
- High deposition rate/ high productivity.
- 2 cathodes
- Competitive price
Need more information?
At ULVAC, we understand that finding the right product is crucial for optimizing your processes, whether you're scaling up production or maintaining precision in your systems. With our wide range of cutting-edge vacuum technologies and in-depth expertise, we will guide you through selecting the ideal solution tailored to your unique requirements.
Contact ULVAC System Sales & Support For inquiries outside North and South America, please contact ULVAC Corporate