Features
- Multiple types of Sputter, Etcher, Asher & PE-CVD modules can be equipped.
- All types of above modules are made by ULVAC.
- Up to Φ300? wafer is applicable.
Applications
- Power Device - Seed & Metal Layer Sputtering
- MEMS Sensor - PZT Sputtering & Etching
- Optical Device - VCSEL Etching
- Packaging - Descum Ashing
- Communication - Insulated film PE-CVD and Etching
Wafer Size
uGmni-200 MaxΦ 200mm
uGmni-300 MaxΦ 300mm
Transfer Core Options
- Square Process Module - Max 2 Chambers
- Hexagonal Process Module - Max 4 Chambers
- Heptagon Process Module - Max 5 Chambers
*above options for Φ200mm, contact for more information regarding Φ300mm
Process Modules Available
- Sputtering
- Etching
- Ashing
- PE-CVD
- Others
Need more information?
At ULVAC, we understand that finding the right product is crucial for optimizing your processes, whether you're scaling up production or maintaining precision in your systems. With our wide range of cutting-edge vacuum technologies and in-depth expertise, we will guide you through selecting the ideal solution tailored to your unique requirements.
Contact ULVAC System Sales & Support For inquiries outside North and South America, please contact ULVAC Corporate