Features
- Multiple types of Sputter, Etcher, Asher & PE-CVD modules can be equipped.
- All types of above modules are made by ULVAC.
- Up to Φ300? wafer is applicable.
Applications
- Power Device - Seed & Metal Layer Sputtering
- MEMS Sensor - PZT Sputtering & Etching
- Optical Device - VCSEL Etching
- Packaging - Descum Ashing
- Communication - Insulated film PE-CVD and Etching
Wafer Size
uGmni-200 MaxΦ 200mm
uGmni-300 MaxΦ 300mm
Transfer Core Options
- Square Process Module - Max 2 Chambers
- Hexagonal Process Module - Max 4 Chambers
- Heptagon Process Module - Max 5 Chambers
*above options for Φ200mm, contact for more information regarding Φ300mm
Process Modules Available
- Sputtering
- Etching
- Ashing
- PE-CVD
- Others
