Sputter Target and Evaporation Materials
With today's demand for sophisticated integrated circuits, our semiconductor materials must be of the highest purity. Unwanted alkali and transition metals, gases, and radioactive elements which corrupt such devices are reduced to minute levels. Our purity standards utilize methods such as Glow Discharge Mass Spectrometry (GDMS), Atomic Emission Spectrometry (AES), and Inductively Coupled Plasma Mass Spectrometry (ICP-MS). Target configurations are constructed to each customer's specifications. Targets supplied can be of single piece "monolithic" construction or bonded to metal backing plates.
|Semiconductor||W(6~8N), Al, Al alloys, Ta, Ti, TiW, MoSi, WSi, TiSi, Cu, PZT, BST, STO|
|Magnetic disk and heads||Cr, Cr, alloys, CoPt alloys, C, Al2O3|
|Flat panel displays||ITO, Cr, SiO2, Mo, Ti alloys, Al alloys|
|Electronic parts||Si3N4, Cr, Al, Ni-Cr, Cu, Pt, Au, ZnO, Ta, Pd, SiO2, etc|
|Optical Communication||Si, SiO2, Mg, ITO, ZnO, Ti, etc|
ULVAC Sputtering Targets Cataloge
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