Sputter Target and Evaporation Materials
With today's demand for sophisticated integrated circuits, our semiconductor materials must be of the highest purity. Unwanted alkali and transition metals, gases, and radioactive elements which corrupt such devices are reduced to minute levels. Our purity standards utilize methods such as Glow Discharge Mass Spectrometry (GDMS), Atomic Emission Spectrometry (AES), and Inductively Coupled Plasma Mass Spectrometry (ICP-MS). Target configurations are constructed to each customer's specifications. Targets supplied can be of single piece "monolithic" construction or bonded to metal backing plates.
ULVAC Sputtering Targets Cataloge
ITO Targets
ULVAC provides high quality targets contributes to high functional films for Flat Panel Displays (FPD). These targets features include stable and enhanced discharge during deposition through refinement and high dispersion of SnO2. Good roughness of target surface, High stability of film resistance after deposition, low particle count.
FPD manufacturing equipment sizes are becoming larger and larger so sputtering target dimensions are also increasing. To improve both production equipment and QA equipment, ULVAC has installed large ultrasonic test equipment to make meticulous defect inspections of materials and bonding inspections. Using this equipment has helped ULVAC drastically cut down on arcing during sputtering and deliver high quality targets.
| Industry | Material |
| Semiconductor | W(6~8N), Al, Al alloys, Ta, Ti, TiW, MoSi, WSi, TiSi, Cu, PZT, BST, STO |
| Magnetic disk and heads | Cr, Cr, alloys, CoPt alloys, C, Al2O3 |
| Flat panel displays | ITO, Cr, SiO2, Mo, Ti alloys, Al alloys |
| Electronic parts | Si3N4, Cr, Al, Ni-Cr, Cu, Pt, Au, ZnO, Ta, Pd, SiO2, etc |
| Optical Communication | Si, SiO2, Mg, ITO, ZnO, Ti, etc |
Contact ULVAC System Sales & Support For inquiries outside North and South America, please contact ULVAC Corporate
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