Key Features
- 3 wafers batch processing availability in 6inch dia.
- 7 wafers batch processing availability in 4inch dia.
- 12 wafers batch processing availability in 3 inch dia.
- 29 wafers batch processing availability in 2 inch dia.
- Equipped with ICP with magnetic field (ISM *1), high density plasma source which has a delivery record of over 600 chambers.*1:ULVAC Patent No.3188353
- Proprietary Star electrode *2:ULVAC Patent No.3429391
- Easy Maintenance, stability, and reliability are achieved through re-deposition prevention.
- Dry etching technology availability for various process application. (GaN, Sapphire, Metal, ITO, SiC, AlN, ZnO, 4 elements compound semiconductor materials, etc.)
- Various system options available
Need more information?
At ULVAC, we understand that finding the right product is crucial for optimizing your processes, whether you're scaling up production or maintaining precision in your systems. With our wide range of cutting-edge vacuum technologies and in-depth expertise, we will guide you through selecting the ideal solution tailored to your unique requirements.
Contact ULVAC System Sales & Support For inquiries outside North and South America, please contact ULVAC Corporate