Key Features
- Flexible module configuration.
- The integration of PVD and CVD/ALD process.
- The various applications (NVM, Al & Cu wiring, TI/TiN barrier metal, thick AL and Co/Ni salicide etc.).
- Process capability for not only Si devices but also compound semiconductor, on quartz devices, etc.
- 10 process modules maximum can be equipped based on the cluster tool concept.
- Single or Tandem platform is available.
- Wafer transfer speed is 60% up. High reductivity and low CO2 were achieved.
- Environmental consideration Various energy saving functions were standard installed, and the energy saving of 30% on the current model was achieved.
- Equipped with the control system that comphes with the next generation semiconductor Fab. The excellent thin film contorol and EES compliance. The high advanced automation Fab compliance.
