ULVAC New Dry Etching System NA-1500
03/17/17ULVAC Launches Dry Etching System "NA-1500" for 600mm Advanced Packaging Substrates --- NA-1500 provides uniform Descum process for large square substrate
Recently, we have developed the dry etching system for 600mm substrate by enhancing the proven plasma source. Our plasma source enables fast and low-temperature etching of resin layer that was impossible with the existing CCP*2 method. This plasma source is applicable to fluorine gases so that seed layer Ti etching, which requires wet process, can be removed without side etching. Furthermore, SiO2 and SiN etching are available.
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