Contact

SMV-500F

  • Share

Seed Layer Sputtering

The ULVAC SMV-500F sputtering system is used for seed layer (Ti/Cu) PCB interposers.

Get More Information

Request Engineering Information Request a Demo 978-686-7550

Specifications

  • Auto Loader, 3 process modules, 1 loadlock
  • Substrates size ~500mm
  • Low temperature process cooling systems
  • Can deposit on various substrate sizes

Need More Information?

Contact ULVAC