Advanced plasma resist strip system specifically designed for non-300mm fabs. Equipped with a versatile platform that can handle the complete line of wafer sizes from 4" to 8"
Dual Chamber Ashing system capable of running two wafer sizes simultaneously from 100mm to 300mm.
NE-550EXa is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.
Dry etching system for high volume production with good cost performance and wide selection of tool configuration.
Industry Leading Deep Oxide Etching
The SME series deposition system is capable of handling up to 200mm substrate size and is available in several configurations from single to six process chambers.
Batch-Type high vacuum evaporation system.
The CC-200/400 is a compact and easy to use CVD system designed for R&D and Production environments.
CME-200E/400 is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.