Specialty Materials and Services

deep oxide etching service

Deep Oxide Etch Process Services

The technical staff of scientists and engineers at ULVAC Technologies, Inc. in Methuen, MA is available to help customers meet the challenges of the most difficult Deep Oxide Etch requirements.

NLD-Series Etch System

  • 100mm - 200mm Single Wafer Processing
  • High density NLD source with low Te using electromagnetic field for plasma confinement
  • Anisotropic profile up to 50µm
  • High SiO2 etching rate, > 500nm/min
  • Low non-uniformity, < + 2% (3o)
  • Spatial and temporal control of plasma
  • Applications: Ni, Ti, WSix, Al2O3, SiO2, TiO2, WN, LiNO3, GaAs, GaN, InP

The NLD system consists of a process chamber with three electromagnetic coils. The RF antenna is concentrically located with the middle coil. The plasma intensity is confined to the plane of the middle coil and the diameter of the plasma is proportional to the electromagnet current.


Applications: Optical Device Fabrication

High Aspect Etch

CVD SiO2; 6.0un deep; Aspect Ratio: 9.0 
 

Side Angle Control

SiO2 Arrayed Waveguide

 

InP Waveguide

Quartz Micro-Lens-Array

 

 

 

 

The NLD Etch System is extremely versatile, enabling etch processes for a variety of optical device materials. Available processes include mask, core and micro lens etching, thereby, reducing the number of systems required for device manufacturing.

Deep Oxide Etch Process Services

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Processing Facility
4,000 Sq. Ft. Cleanroom
NLD-6000 Etch System
ENVIRO Asher 
Wet Clean Systems
SEM & Metrology Tools
100mm - 200mm wafers
Glass, Quartz and Silica Substrates

CONTACT ULVAC
for more information
NLD Etch Services
ULVAC MEMS FOUNDRY,MEMS FOUNDRY,ETCH SERVICES,DEEP OXIDE ETCH SERVICES
ULVAC MEMS FOUNDRY SERVICES DEEP OXIDE ETCHING SERVICE