Specialty Materials and Services

deep oxide etching service

ULVAC TECHNOLOGIES, INC. USA HEADQUARTERS METHUEN MA 

MEMS Etch Foundry Services

- Deep Oxide -

- Ashing -

- III-V Materials & Metal Etching -

Visit Material Research Institute at Penn State University

ULVAC's etch products and foundry services enable you to achieve more reliable and repeatable process performance for your MEMS, MOEMS, microfluidic and photonic devices. ULVAC helps you accelerate device fabrication, eliminate prototype to product variability, and reduce costly time-to-market delays.

Our equipment features ULVAC's unique and extremely versatile Neutral Loop Discharge (NLD) plasma source technology which enables:

● Superior profile control and surface roughness
● Low non-uniformity
● Excellent performance of deep SiO2 etching with PR
● High etching rate of Quartz > 1μm/min, Pyrex > 0.8 μm/min, SiO2 > 0.5 μm/min
● Low process pressure, high density plasma, low electron temperature
● Robust etching for Quartz, Pyrex, LN, LT, and other glass materials
● Support for 100mm to 200mm wafers
● Anisotropic profile up to 50µm
● Application support for Ni, Ti, WSix, Al2O3, SiO2, TiO2, WN, LiNO3, GaAs, GaN, InP

For more information, please email us at sales@us.ulvac.com or call at 978-686-7550.

Processing Facility
4,000 Sq. Ft. Cleanroom
NLD-6000 Etch System
ENVIRO Asher 
Wet Clean Systems
SEM & Metrology Tools
100mm - 200mm wafers
Glass, Quartz and Silica Substrates

CONTACT ULVAC
for more information
NLD Etch Services
ULVAC MEMS FOUNDRY,MEMS FOUNDRY,ETCH SERVICES,DEEP OXIDE ETCH SERVICES
ULVAC MEMS FOUNDRY SERVICES DEEP OXIDE ETCHING SERVICE