Features
- Long term stable measurements results
- Closed Ion Source Utilizing a Magnetic Field
- Soft ionization provides less gas dissociation and higher sensitivity
- Decomposition and adsorption due to thermal reactions are minimized in the ionization chamber
- Short distance between the process chamber and ion source allows quick-response of analysis
- Wide pressure range from 10-6 to 13kPa is available. (Choice of orifices)
- No need for PC
- "One Click" function
- Max 120ºC High temperature bakeing.
- Electron bombard degas
- Protection and maintenance of ion source and secondary electron multiplier
- Traceability of analysis tube (patent pending)
- Various Leak Tests are Available (Helium leak test, air leak test, leak up)
- Capable of total pressure measurement (External ionization gauge GI-M2)
- This software is included and compatible with (Windows XP/7)
Applications
- For etching and CVD process
- Monitoring reactive gases during process
- End-point monitoring for etching and cleaning processes
- Residual gas analyzing
- Leak testing
