Key Features
- 75mm - 200mm Wafer Size.
- Six-sided core, up to 4 process chambers.
- Accurate film control with low particles
| Specification | MLX-3000N |
| Transfer System | 6 sided transfer module x 1 |
| Module |
Load/Unload module: 2 modules (or 1 module and 1 degas) Process module: Maximum of 4 modules |
| Wafer Size | 75mm - 200mm diameter (3 to 8 inch) |
| Transfer Robot | Vacuum transfer robot with double pick-up |
| Control System | PC control system |
| Applications | Power Devices (front side and backside), UBM, Mounted Device, SAW Device, Non-Standard Shaped Wafers |
| Main Pumps |
Load/Unload Module: Dry Pump Transfer Module, TMP Process Module: Cryo Pump |
| Roughing Pump | Dry Pump |
| Process Gas Line | Maximum of 3 Lines |
| Ultimate Pressure |
Transfer: 1.3 x 10E-4Pa (1.0 x 10E-6 Torr) Process Module: 1.0 x 10E-5Pa (7.5x10E-8 Torr) |
| Electricity | 50Hz/60Hz, 3Phase, AC 200V |
| Cooling Water | 0.2 - 0.3MPa, Temperature 20 - 25°C, 100L/min |
| Gas |
Process Gas: 0.05 - 0.1MPa (Dependent on variety gas) Nitrogen: 0.05 - 0.1MPa |
| Compressed Air | 0.55 - 0.75MPa |
| Grounding | A Class (1st Class) Ground Line (10 ohm or less) |
| Options |
3" to 8" (75mm to 200mm diameter) wafer available Shutter mechanism Electrostatic chuck RGA: Qulee Loadlock module (optional TMP available) |
