UBM / CSP 

SRH Series for Ultra Thin Wafer Handling

Ultra Thin Wafer
Thickness: 100µm~50µm
Size: 125mm, 150mm, 200mm, 300mm

Features

• For manufacturing Power Device (IGBT),
  Smart Card, 3D stacked Devices, etc.
• Unmatched cost performance
• 50µm thick wafer handling
• ESC Stage for Wafer Cooling
• Capable for handling Supported Wafer (WSS)
• Simple to convert system to various
  Wafer Sizes
• Compatible for both Thin Wafer and
  Standard SEMI Wafer