UBM / CSP 

SRH Series

The SRH Series are single-wafer sputtering systems for mounting/UBM. A unique transfer mechanism and process chamber structure enable the extremely high cost performance demanded by deposition systems for mounting/UBM. SRH-730 (SRH-820) lets you mount up to 6 (7) process chambers, for a process chamber layout to meet precise needs.

Features

• SRH-730 (300/200 mm wafers) can be used for either 300 or 200 mm wafers alone, or different size load ports can be attached to the wafer transfer unit to enable continuous processing of different wafer sizes.
• SRH-820 (200/150/100 mm wafers) can process different wafer sizes by changing the wafer transfer unit (takes about 5 minutes).
• SRH-420MC(200/150/100 mm wafers) is possible to process ultra thin wafers.
• All series models have been designed and manufactured in conformance with the SEMI safety standard.
• Since many process chambers can be mounted, configurations can be designed for needs such as low cost, full production with longer maintenance cycles, or multiple-product lines with different target processes.
• Since each process chamber is independent, conditions can be set for each chamber individually.

Applications

• UBM/barrier layers, adhering layers, plating seed layers, surface refining, other
• Back-surface electrodes/barrier layers, adhering layers

Specifications