 Metal
Film Metrology
MESEC
MESEC SAT-3000 (stand-alone
type)
MESEC BIT-2000 / 3000 (built-in types)
The cost effective in-tool
or stand alone copper film thickness and uniformity measurement
system.
Benefits
MESEC - A cost-effective metrology
system for metal film thickness measurements.
IMPROVE PROCESS RELIABILITY
MESEC gives you reliable,
metal film thickness measurements using Eddy current detection
technology. Now you can make process corrections fast.
- Non-contact, non-destructive measurements
- Directly evaluate device wafers, not test/witness
wafers
- Copper films from 0.03um to 5um can be measured
faster and more accurately
REDUCE COST
MESEC is available at a fraction
of the cost of other metrology systems. ULVAC makes it easy
to add MESEC to your PVD, CVD, plating and CMP processes
- for either 200mm or 300mm applications.
- Retrofit your existing process tool
 Integrate
it into your new tool - Buy it as a stand-alone
system
Features
- Measures metal thin-film thickness and sheet
resistance non-destructively and without contact.
- Built-in models have a compact eddy current
sensor that gives quick measurement speed which enables
MESEC to be integrated into PVD, CVD, plating, CMP or similar
tools where accurate measurement of metal film thickness
is critical.
- ULVAC's advanced measurement electronics eliminates
measurement drift and results in outstanding reproducibility.
 Data
Analysis Features
The software supplied with
the MESEC stand-alone version has full surface metrology and
data analysis capabilities.
Single point, multi-point
diameter scans and multi-point 3-D surface scan functionality
is included.
Applications
- Metal film thickness / sheet resistance quality
control in semiconductor manufacturing
- Deposition system status checks, process evaluations
- Providing real-time process control information
to deposition equipment
Specifications
| Film thickness measurement range |
0.03 to 5µm |
| Measurement precision (relative to calibrated
value) |
±1% |
| Measurement reproducibility |
±0.5% (1 sigma, measurement
of same point 10 times consecutively) |
| Measurable film types |
Cu, Al, AlCu and other metal
films |
| Measurement spatial resolution |
3mm |
| Measurement speed |
1 sec/point max. (excluding
time for stage movement and wafer transfer) |
| Stage type |
X-Y type linear stage (SAT)/Rotary
type stage (BIT) |
| Stage precision |
X-axis : ±0.05mm(SAT)/R-axis
:±0.1 mm (BIT)
Y-axis : ±0.05mm(SAT)/Theta-axis : ±0.05º(BIT) |
| Sample size |
200 and 300 mm wafers |
| Measurement results |
Film thickness, sheet resistance |
Unit dimensions
(W x D x H; mm) |
1,400 x 1,200 x 1,300 (SAT)/Depends
on how unit is attached to deposition system (BIT) |
| Weight (kg) |
450 (SAT)/Depends on how
unit is attached to deposition system (BIT) |
| Utilities |
Power supply : 100 V, 10
A ; Vacuum : 400 mm Hg max. ; Pressurized air : 0.4
MPa min. |
| Operating system |
Windows NT 4.0 |
Click
here to download the PDF file.
For
more information |
|
TEL
: 978-686-7550/ FAX : 978-689-6300 |
|
