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   ULVAC Technologies, Inc.
   401 Griffin Brook Drive
   Methuen, MA 01844

   Tel: 978-686-7550
   Fax: 978-689-6300


 Implant 

IW-630 for Ultra Thin Wafer Handling

Thickness: 100µm ~ 50µm
Size: 125mm, 150mm, 200mm

Features

  • For manufacturing Power Device (IGBT), Smart Cards, 3D stacked Devices, etc.
  • 50µ thick handling without Support
  • ESC Platen for Cooling
  • Compatibel for both Thin Wafer and Standard SEMI Wafer
For more information
Please Email Us
TEL : 978-686-7550/ FAX : 978-689-6300

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