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ULVAC Technologies, Inc.
401 Griffin Brook Drive
Methuen, MA 01844
Tel: 978-686-7550
Fax: 978-689-6300 |
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Implant
IW-630
for Ultra Thin Wafer Handling
Thickness: 100µm ~ 50µm
Size: 125mm, 150mm, 200mm
Features
- For manufacturing Power Device (IGBT), Smart Cards, 3D stacked Devices, etc.
- 50µ thick handling without Support
- ESC Platen for Cooling
- Compatibel for both Thin Wafer and Standard SEMI Wafer
For
more information |
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TEL
: 978-686-7550/ FAX : 978-689-6300 |
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