| Resist Strip |
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The ENVIRO-Xceed400 advanced plasma resist strip system from ULVAC is the latest photoresist removal equipment offering exceptional performance at an incredible price. |
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The Enviro Optima™ Resist
Strip System is the smallest 300mm resist strip system providing
the highest throughput per square meter of cleanroom space
at the lowest cost. |
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The ENVIRO III Platform is designed for challenging resist and residue removal applications. It features Dual plasma source (microwave downstream and RF) |
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| Copper Interconnect Metallization |
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Our Entron System for Copper Metallization is pushing the envelope of PVD, ULVAC
Self-Ionized Sputter (SIS) Technology and Entron System takes you to the 32nm generation. |
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| Implant |
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ULVAC's IW-630
Ion Implantation Systems have grown to keep pace with device evolution. ULVAC
can provide applications to meet demands for custom bipolar
devices, and for next-generation wafer processes such as SOI,
SOS, SiC wafer and ultra thin wafer
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| Metal Film Metrology |
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MESEC - A cost-effective metrology system for metal film thickness measurements. MESEC gives you reliable,
metal film thickness measurements using Eddy current detection
technology. |
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| MRAM |
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| Front End Metallization |
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Entron System for Front End Of Line Metallization (FEOL) |
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| UBM / CSP |
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The SRH Series are single-wafer sputtering systems for mounting/UBM. A unique transfer mechanism and process chamber structure enable the extremely high cost performance demanded by deposition systems for mounting/UBM. |
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| Other Metalization |
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