Resist Strip 

Enviro Xceed400 - Resist Strip System

The ENVIRO-Xceed400 advanced plasma resist strip system from ULVAC is the latest photoresist removal equipment offering exceptional performance at an incredible price. Specifically designed for 300mm fabs, it is equipped with a proprietary vacuum transfer platform with very fast speed. The system is capable of high speed photoresist removal at more than 10μm/min, with excellent repeatability and high reliability. The ENVIRO-Xceed400 has integrated all the demands from device manufacturers – compact design, high throughput, low cost, less consumable – to deliver the lowest Cost of Ownership (CoO).

Features

• 12 inch (300mm) wafer size
• Novel, proprietary vacuum transfer platform
• New high efficiency downstream plasma source
• RF wafer bias option
• >10 µm/min strip rate
• Excellent uniformity and repeatability
• 400 WPH throughput
• Compact footprint
• Low capital and running
• EU-RoHS compliant

Applications

•  Post High Dose Implant Resist Removal
•  Bulk Resist Strip
•  Descum