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Resist Strip
 Enviro™
III Platform
Features
- 200/300mm wafer compatible
- Equipment from end module (EFEM) with FOUP,
SMIF or open cassette
- Windows XP based system software with graphical
user interface
- Modular design to accept roll-up process modules
- Two process modules offered: Advantage™
and Alpps™
Enviro™ III Process Modules
- Advantage™ process module
- Designed for challenging resist and residue removal applications
- Dual plasma source (microwave downstream and RF)
- Alpps™ process module
- Designed for resist removal from Cu/ultra low-k dual damascene
- Inductive coupled WCP plasma source and RF wafer bias
- Turbo molecular pump
- Electrostatic wafer chuck
Advantge™ III Processes
Post high dose implant strip.
Advantge™ Processes
Post via etch strip (no post solvent clean
required).
Alpps™ Ultra Low k Process
No top residue reducing need for post-ash
wet clean. No low k voids.
For
more information |
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TEL
: 978-686-7550/ FAX : 978-689-6300 |
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