Resist Strip 

Enviro™ II Platform

Production proven resist strip and residue clean solutions.

High Does Implant

• "Popping-free" HDI resist strip process in production since 1995

Post-Oxide Via Etch

• Solvent-free via deveil process in production since 1998.

Post-Low k Etch

• Low-k (OSG) via resist strip process in production since 2000.

Enviro™ II System Features

• Microwave & RIE in same reactor
• High throughput dual reactor processing
• Vacuum isolated (load locked) reactor
• Closed loop wafer temperature control
• Precise optical emission end-point control
• Flexible process chemistry with 6 MFCs
• Toxic, corrosive gas compatible gas box design
• Windows XP™ based graphical user interface
• Independent processing mode in each reactor

Cost Savings from Solvent-Free Enviro™ Via Process at Motorola