Copper Interconnect Metallization
 Entron
System for Copper Metallization
Pushing the envelop of PVD, ULVAC
Self-Ionized Sputter (SIS) Technology and Entron System takes you to the 32nm generation.
Features
- Space Saving Single (3 chambers) or Tandem
(6 chambers) Platform
- Single Wafer Load/Unload Chambers with Degas and Cool
Capabilities
- PVD and ALD compatible configuration available
For
more information |
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TEL
: 978-686-7550/ FAX : 978-689-6300 |
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