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ULVAC Technologies, Inc.
401 Griffin Brook Drive
Methuen, MA 01844
Tel: 978-686-7550
Fax: 978-689-6300 |
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Sputtering Systems
Jsputter JSP-8000 Sputtering System for R&D
Jsputter is available for small
production or research and development of multi-layer thin film,
compound materials or other devices, using automatic process
operation by PC. From 2inch to 8 inch size substrate is available.
Features
- Side deposition configuration is adopted for
reduction of particles.
- 4 inch dia. cathodes of 4 sets are equipped
for standard spec. Substrate is available for 2-8 inch dia.
- System is operated automatically by PC, to
put the process recipe. Wafer transfer is also automatically driven.
- Col sputtering configuration for muiti layer
film. Additional power supply is available for simultaneous sputtering.
- Foot space is deducted by design of all in one system.
Applications
- MRAM, magnetic sensor devices
- Pilot production of discrete devices for electrode
- Research and development for new materials
- Ferro magnetic film for MEMS or ITO film for solar cell or small FPD
Specifications
Ultimate pressure/deposition
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Less than 7x10-5Pa |
Ultimate pressure/loadlock
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Less than 10Pa |
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pumping speed at LL |
Less than 2 minuts till 10Pa |
| Uniformity |
Within f200mm ±5% |
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Load lock & deposition chamber
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Substrate size |
2~8 inch dia. with wafer tray |
Deposition methode |
Side deposition methode |
Cathode |
4 inch dia. x 4 sets |
Reverse sputtering |
Equipped on deposition stage |
Transfer system |
Air actuator tranfer |
Cathode power supply |
RF 500W x 1 set with selector |
Pumping system |
TMP + Rotary pump |
Control system |
PC operation |
Substrate heater/cooling |
300 degree C/ water cooling |
For
more information |
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TEL
: 978-686-7550/ FAX : 978-689-6300 |
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