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ULVAC Technologies, Inc.
401 Griffin Brook Drive
Methuen, MA 01844
Tel: 978-686-7550
Fax: 978-689-6300 |
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Sputtering Systems
 Compact
Sputter ACS-4000-C3
The Compact sputtering system is available for research and development of multi layer thin films, compound materials or other devices. It provides automatic process operation via PC and can handle up to 4” diameter substrates.
Features
- Easy maintenance through hinged flange on
the top of chamber.
- Three sets of Long Throw Sputtering (LTS)
cathodes are equipped for 2” diameter substrates. Also available
for 4” diameter substrates.
- Automatic operation controlled by PC.
- Motor driven wafer transfer from loadlock
to process chamber.
- Conformal sputtering system for muiti layer
film or alloy film processes.
- Reduced footprint by utilizing compact electronic
control rack for instrumention (not shown).
Applications
- MRAM, magnetic sensor devices
- Pilot production of discrete devices for
electrodes
- Research and development of new materials
- Educational tool or multi purpose use
Specifications
Substrate
size |
φ4
inch dia. ( thickness max. 1mm ) x 1 piece/batch |
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Chambers
( Load-lock chamber & Sputtering chamber ) |
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Load-lock
chamber |
Substrate
transfer |
Motor drive transfer system |
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Pumping system
ultimate pressure |
50 L/sec(N2) turbo molecular pump and oil rotary
pump
~6.7 x 10-4Pa |
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Chamber
size |
Approximately φ400
mm x H 600 mm cylindrical chamber
made from stainless steel |
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Substrate
heating |
Max. temp. 500°C |
Cathodes |
Target size, Q inch diameter. Type: LTS
RF power supply with matching box x 3 (with cooling
fan)
*Co-sputtering can be controlled by PC |
| Pumping
system
final pressure |
400 L/sec turbo molecular pump and oil rotary pump
~1 x 10-7Pa |
For
more information |
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TEL
: 978-686-7550/ FAX : 978-689-6300 |
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