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ULVAC Technologies, Inc.
401 Griffin Brook Drive
Methuen, MA 01844
Tel: 978-686-7550
Fax: 978-689-6300 |
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Sputtering Systems
R & D Dielectric Sputtering
System
his sputtering system consists of modular units, including a platform, load lock chamber and sputtering chamber.
Specialized in sputtering dielectrics.
Features
- Pumping, transfer and processing are controlled
completely automatically through recipe by operation from
the touch display panel.
- Designed for dielectric film, including PZT.
- Choice of large-diameter cathode or small-diameter
cathode
- Flexibility to accept substrates of differing
sizes
Applications
- Research of nonvolatile memory like FRAM
and others and application to MEMS by sputtering dielectrics
Specifications
Substrate
size |
3-inch
substratex1 pc. |
6-inch
substratex1 pc. |
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Deposition
up, total area erosion type |
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Substrate heating mechanism |
Maximum 800°C |
Maximum
650°C |
| Film thickness
uniformity |
Within
±5% |
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6.7 *
10-6Pa |
Surface
treatment |
"SUS
Pika" |
Operation |
Completely
automatic from touch display panel |
Sputtering
power supply |
RF13.56MHz 200W |
RF13.56MHz 3kW |
Gas
feed system |
Ar,
O2: Mass flow control |
Substrate
transfer |
3-step
sliding transfer robot |
For
more information |
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TEL
: 978-686-7550/ FAX : 978-689-6300 |
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