ULVAC TECHNOLOGIES INSTALLS DRIE PLASMA ETCH SYSTEM IN THE NANOELECTRONICS RESEARCH FACILITY (NRF) AT UCLA

Methuen, Massachusetts - July 2007 - ULVAC Technologies, Inc. announced it has installed a NLD-570 DRIE Plasma Etch System in the Nanoelectronics Research Facility (NRF) at UCLA. The new NLD-570 Etch System is capable of deep etching nano-scale features and is specifically designed for research and prototyping environments. The NLD-570 Etch System compliments the NLD-5700 high volume production version system.

The Nanoelectronics Research Facility (NRF) at UCLA (www.nanolab.ucla.edu) is an open research facility designed for micro and nanofabrication. The facility currently supports about 300 students and 35 companies and Universities in all aspects of device fabrication including MEMS, MOEMS, photonics, microfluidics, novel FET structures etc. Deep etching of glass is expected to be a growing application in the NRF.

ULVAC Technologies was selected by the NRF after demonstrating superior process technology. Ulvac's Patented NLD etch technology delivers superior process performance over standard ICP plasma systems resulting in better device performance and higher prototype and manufacturing yields.

ULVAC Technologies, Inc. offers Deep Etch Process Foundry Services in the United States for Semiconductor, MEMS, MOEMS, Microfluidic, and Photonic devices. Using ULVAC's NLD Etch System, product developers can achieve reliable and repeatable deep etching of devices. This repeatability accelerates device fabrication, eliminates prototype to manufacturing variability and reduces costly time-to-market delays.

At ULVAC's cleanroom facility in Methuen MA, devices have been successfully fabricated using ULVAC's suite of standard deep etch process recipes. Process recipes can be customized to meet individual device fabrication requirements. A team of scientists and engineers at ULVAC are currently providing solutions to the most challenging deep etch requirements.

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