ULVAC Technologies, Inc.
401 Griffin Brook Drive
Methuen, MA 01844
Tel: 978-686-7550
Fax: 978-689-6300
Etching
Si for MEMS
This system incorporated technology
of high-speed silicon etching. The model range are available
from prototypes for R&D to multi-chamber types for mass-production.
Features
High-speed (Up to 50µm/min.) etching
Anisotropic form
Smooth side walls
Non bosch process alternative
Applications
Si MEMS
Mounting (SiP)
Chip on chip
Specifications
Item
Specification
System configuration
R&D/prototype
system with Load Lock function Completely automatic mass-production
system
(one chamber or multiple chambers)
Substrate size
Up to 200 mm
Uniformity within substrate/substrate to
substrate surfaces
