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   ULVAC Technologies, Inc.
   401 Griffin Brook Drive
   Methuen, MA 01844

   Tel: 978-686-7550
   Fax: 978-689-6300


 Etching 

RD Equipment

CE-300I High-Density Plasma Etching System for R&D CE-300I:ISM (Inductively Super Magnetron) is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.

Features

  • Equip with low-pressure, low-electron-temperature and high-density plasma source.
  • Supports wide range of process control from ion etching to radical etching.
  • Plasma density and uniformity can be controlled by optimizing magnetic field.
  • Simple configuration makes maintenance easy.

Applications

  • Ultra-high frequency devices, optical devices (LEDs, LDs)
  • Next-generation non-volatile memory
  • Biochips and microfluid devices
  • Photonic crystals
  • Sensors, MEMS (micro-electromechanical systems)

Specifications

Item Specification
System configuration R&D/prototype system with Load Lock function
Substrate size Up to 150 mm
Operating pressure (Pa) 0.07 to 6.7
Uniformity within substrate/substrate to substrate surfaces ±3% max.
Substrate temperature control Electrostatic chuck


For more information
Please Email Us
TEL : 978-686-7550/ FAX : 978-689-6300

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