Sputtering target and evaporation source materials are widely used for manufacturing thin film devices, LSI, memory storage, optical thin film, optical communication, display electronic parts, etc. Application fields are increasing. Ulvac extends service to various and high market demands. Ulvac has been a major supplier in Japan and Asia.

With today's demand for sophisticated integrated circuits, our semiconductor materials must be of the highest purity. Unwanted alkali and transition metals, gases, and radioactive elements which corrupt such devices are reduced to minute levels. Our purity standards utilize methods such as Glow Discharge Mass Spectrometry (GDMS), Atomic Emission Spectromentry (AES), and Inductively Coupled Plasma Mass Spectrometry (ICP-MS).

Main products for semiconductor:
W(6~8N), Al, Al alloys, Ta, Ti, TiW, MoSi, WSi, TiSi, Cu, PZT, BST, STO

Main products for magnetic disk and heads:
Cr, Cr alloys, CoPt alloys, C, Al₂O₃

Main products for flat panel displays:
ITO, Cr, S_iO₂, Mo, Ti alloys, Al alloys

Main products for electronic parts:
Si3N4, Cr, Al, Ni-Cr, Cu, Pt, Au, ZnO, Ta, Pd, SiO2, etc

Main products for optics/optical communication:
Si, SiO2, Mg, ITO, ZnO, Ti, etc



Target configurations are constructed to each customer's specifications. Targets supplied can be of single piece "monolithic" construction or bonded to metal backing plates. We can supply such targets to fit a variety of sputtering systems including ULVAC, Applied Materials, Anelva, Novellus/Varian, TEL/MRC, Unaxis/Balzers/Leybold, etc

Various types of deposition materials for heating, including materials for ornament and electronic parts, are available.

• Materials: Pure metal, alloy (Co alloy, Ni alloy, etc.), oxide materials (alumina, ITO, etc.), sulfur materials, nitride, etc.