Semiconductor

MagestTM S200 provides the multi-layer deposition of ultra thin films under the ultra high vacuum condition and is applicable for the deposition of various materials by RF or DC sputtering.

Features

  • UHV (ultra-high vacuum) processes.
  • Triple-gun cathode.
  • Outstanding controllability and reproducibility with ultra-thin films of 10 nm or less
  • Excellent control of magnetic anisotropy and coercive force

Applications

  • MRAM and Magnetic Device
  • Materials development