Semiconductor

ULVAC OFFERS NEXT GENERATION Non-volatile memory TECHNOLOGIES, SUCH AS SPUTTERING AND DRY ETCHING FOR MEMORY DEVICES.

Considered by many as the memory of the future, the miniaturization of state-of-the-art devices, which are now being widely used, has become a significant issue. As such, it is thought that 3D cells will emerge as the next-generation of device. 

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