Deep Oxide Etch Services 

Deep Oxide Etch Process Services for MEMS, MOEMS, Photonics and Glass Substrate Applications. Etch services performed on ULVAC’s NLD-6000 Etch System with the patented Magnetic Neutral Loop Discharge (NLD). State-of-the-art uniformity, etch profiles, smooth sidewalls, and high etch rates achieved.

ULVAC Technologies, Inc.
Facilities & Services

Main Building
Located in Methuen, MA
42,000 sq. ft. facility
4,000 sq. ft. cleanrooms
Equipment Manufacturing
Deep Oxide Etch Services
ISO 9001 Certified

Processing Facility
4,000 Sq. Ft. Cleanroom
NLD-6000 Etch System
ENVIRO Asher
Wet Clean Systems
SEM & Metrology Tools
100mm - 200mm wafers
Glass, Quartz and Silica Substrates

Staff of Engineers and Scientists
The technical staff of scientists and engineers at ULVAC Technologies, Inc. in Methuen, MA is available to help customers meet the challenges of the most difficult Deep Oxide Etch requirements.


NLD Etch Process Equipment

NLD-Series Etch System

• 100mm - 200mm Single Wafer Processing
• High density NLD source with low Te using electromagnetic field for plasma confinement
• Anisotropic profile up to 50µm
• High SiO2 etching rate, > 500nm/min
• Low non-uniformity, < + 2% (3o)
• Spatial and temporal control of plasma
• Applications: Ni, Ti, WSix, Al2O3, SiO2, TiO2, WN, LiNO3, GaAs, GaN, InP

The NLD system consists of a process chamber with three electromagnetic coils. The RF antenna is concentrically located with the middle coil. The plasma intensity is confined to the plane of the middle coil and the diameter of the plasma is proportional to the electromagnet current.

This graph illustrates the effect of plasma diameter on etch rate distribution for a SiO2 etch process. The lowest uniformity is achieved by dynamically controlling the plasma diameter during processing.

Applications: Optical Device Fabrication

High Aspect Etch CVD SiO2; 6.0un deep; Aspect Ratio: 9.0	Side Angle Control
SiO2 Arrayed Waveguide	InP Waveguide
Quartz Micro-Lens-Array	The NLD Etch System is extremely versatile, enabling etch processes for a variety of optical device materials. Available processes include mask, core and micro lens etching, thereby, reducing the number of systems required for device manufacturing.

Deep Oxide Etch Process Services

For Information or Processing Requests Contact:

ULVAC Technologies, Inc
401 Griffin Brook Drive
Methuen, MA, 01844
Phone: (978) 686-7550
Fax: (978) 689-6300
Email: etchservices@us.ulvac.com