|
|
 |
|
|
 |
ULVAC Technologies, Inc.
401 Griffin Brook Drive
Methuen, MA 01844
Tel: 978-686-7550
Fax: 978-689-6300 |
|
|
 |
Sputtering Systems
 Batch-type
sputtering systems SV Series
Vertical batch-type sputter
systems. Series models include the SV-200 disk stamper model,
and carousel types for large-volume substrate processing.
Features
- SV-4540, 6040 and 9045 are carousel types that can load a large volume of substrates. They are ideal for small- to medium-scale production, or for low-volume production of many different substrate types.
- SV-200 is a system specialized for disk stamper Ni deposition. It features an ultra-compact design, fully-automatic operation and high throughput.
Applications
- Deposition of electrode films, insulating films or dielectric films on various substrates
Specifications
| |
SV-200
|
SV-4540
|
SV-6040
|
SV-9045
|
| Standard evacuation system |
8-inch cryopump
|
12-inch cryopump
|
12-inch cryopump
|
16-inch cryopump
|
| Final pressure |
6.7e-5Pa
|
6.7e-5Pa
|
6.7e-5Pa
|
6.7e-5Pa
|
| Deposition direction |
Side
|
Side
|
Side
|
Side
|
Deposition area uniformity
Static Rotary |
f200mm ± 5%
|
L300mm ± 10%
|
L300mm ± 10%
|
L400mm ± 10%
|
| Substrate heating |
None
|
250°C
|
250°C
|
250°C
|
| Control system |
Automatic
|
Automatic
|
Automatic
|
Automatic
|
| Options (except
SV-200) |
Turbo pump
|
Drainage cold electrode
|
|
Oil diffusion pump
|
APC mechanism
|
|
Simultaneous multi-source deposition
|
Substrate reversing mechanism
|
|
Down deposition
|
Reactive sputter
|
|
Conventional cathode
|
|
|
Cathode for strong magnets
|
|
|
RF etch cleaning (SV-4540)
|
|
|
Bias mechanism (SV-4540)
|
|
For
more information |
|
TEL
: 978-686-7550/ FAX : 978-689-6300 |
|
|
