Ulvac Home

    

Search:

 


   ULVAC Technologies, Inc.
   401 Griffin Brook Drive
   Methuen, MA 01844

   Tel: 978-686-7550
   Fax: 978-689-6300


 Sputtering Systems 

SH and SIH Series Sputtering Systems

Parallel-beam batch type and load-lock type sputter systems. Series models include batch types, simple load-lock types with a linear input mechanism, and tray-transfer load-lock types.

Features

  • Wide range of options enables use in many applications, ranging from R&D to small-scale production.
  • Substrate electrode diameters of between 100 to 550 mm can be selected to meet desired scale.
  • Target diameters range from 80 to 200 mm for each model. Targets for non-magnetic or magnetic substances

Applications

  • Deposition of electrode films, insulating films or dielectric films on various substrates

Specifications

 
SH-S100
SH-250
SH-350E
Standard evacuation system
4-inch diffusion pump
6-inch cryopump
6-inch cryopump
Final pressure
1e-4Pa
6.7e-5Pa
6.7e-5Pa
Deposition direction
Up
Up
Up
Deposition area uniformity
Static
Rotary
µ50mm ± 10%
µ40/µ50mm ± 10%
ID90xOD170mm ± 5%
/ID80xOD180mm ± 5%
f50mm ± 10%
ID150xOD250mm ± 5%
Substrate heating
300°C
300°C
300°C
Control system
Manual
Evacuation: Automatic; Deposition: Manual
Automatic

 
SH-350/SH-350N
SH-450
SH-550
Standard evacuation system
8-inch cryopump
10-inch cryopump
12-inch cryopump
Final pressure
6.7e-5Pa
6.7e-5Pa
6.7e-5Pa
Deposition direction
Up
Up
Up
Deposition area uniformity
Static
Rotary
µ50mm ± 10%
ID150xOD250mm ± 5%
µ75mm ± 10%
ID255xOD405mm ± 5%
µ100mm ± 10%
ID270xOD470mm ± 5%
Substrate heating
300°C
300°C
300°C
Control system
Automatic
(touch-panel)
Automatic
(touch-panel)
Automatic
(touch-panel)

 
SIH-350
SIH-450
SIH-550
Standard evacuation system
8-inch cryopump
10-inch cryopump
10-inch cryopump
Final pressure
6.7e-5Pa
6.7e-5Pa
6.7e-5Pa
Deposition direction
Up
Up
Up
Deposition area uniformity
Static
Rotary
µ50mm ± 10%
ID150xOD250mm ± 5%
µ75mm ± 10%
ID255xOD405mm ± 5%
µ100mm ± 10%
ID270xOD470mm ± 5%
Substrate heating
300°C
300°C
300°C
Control system
Automatic
(touch-panel)
Automatic
(touch-panel)
Automatic
(touch-panel)

Options
Turbo pump
High-temperature heating
Oil diffusion pump
(except SH-350N)
Drainage cold electrode
Simultaneous multi-source deposition High-speed rotary electrode
Simultaneous multi-source deposition
High-speed rotary electrode
Down deposition
APC mechanism
Conventional cathode
Reactive sputter
Cathode for strong magnets
Simple load-lock mechanism
RF etch cleaning
Bias mechanism

For more information
Please Email Us
TEL : 978-686-7550/ FAX : 978-689-6300

^top   
 
Copyright 2009. ULVAC Technologies, Inc. All rights reserved.| Terms for using this site .