Sputtering Systems 

MPS Series Ultra-High Vacuum Helicon Sputter Systems

ULVAC's helicon sputter systems are a new type developed using our wealth of experience and extensive sales record. Discharge can be maintained at a pressure of 7 x 10^-2 Pa, about one order of magnitude lower than the conventional sputter discharge pressure. The use of long throw sputtering enables better film thickness uniformity, and the diagonal incidence configuration is ideal for co-sputter and multilayer films.

Features

• Low-pressure processes - Can maintain discharge at the range of pressure of about 7 x 10^-2 to 0.26 Pa, roughly one order of magnitude lower than the conventional sputter discharge pressure.
• Good film thickness uniformity - Extremely good film thickness uniformity even with targets of the same diameter as the substrate.
• Stable low rate - control Helicon sputter enables the film thickness to be controlled to within a few angstroms.
• Compact equipment layout - Stores multi-element cathodes in a single chamber, eliminating the need for the multiple chambers of conventional systems, and enabling a compact design.

Applications

• Research and development

Specifications