MPS-4000-HC6 Sputtering System for MRAM/TMR Research

   ULVAC Technologies, Inc.
   401 Griffin Brook Drive
   Methuen, MA 01844

Tel: 978-686-7550
Fax: 978-689-6300

Sputtering Systems

MPS-4000-HC6 Sputtering System for MRAM/TMR Research

MPS-4000-HC6 is the ideal sputtering system for deposition of MRAM/TMR multilayer films. The deposition cathode is a helicon sputtering cathode enabling low-pressure processes. There are a total of three chambers (preparation chamber, oxidation chamber and deposition chamber). The oxidation chamber is just for depositing tunnel barrier layers.

Features

Low-pressure processes - Can maintain discharge at a pressure range of about 7 x 10^-2 to 0.26 Pa, enabling sputtering at a pressure roughly one order of magnitude lower than that of conventional systems.
Good film thickness uniformity - Long throw sputtering effect enables extremely good film thickness uniformity even with targets of the same diameter as the substrate.
Stable low rate control - Helicon sputtering enables the film thickness to be controlled to within a few angstroms.
ULVAC original oxidation method - The oxidation chamber's helicon sputtering cathode enables plasma oxidation/radical oxidation using an ICP coil. The chamber also supports conventional natural oxidation methods.
Good film interfaces - Use of ultra-high vacuum keeps film interfaces clean.

Applications

MRAM/TMR research and development

Specifications

MPS-4000-HC6
Number of mounted cathodes	Up to 8
Uniform magnetic field application mechanism	Provided as standard (More than 100 Oe at center of substrate)
Ultimate pressure	Less than 7 x 10^-7Pa
Substrate size	100 mm diameter max. (x 1)
Heating mechanism	Max. 300°C
Film thickness uniformity	±3% or less in 75 mm diameter
Maximum gas supply rate	Ar : 150 SCCM
Target size	Diameter : 50 mm (2 inches)
Distance between target and substrate	200 mm approx
Deposition pressure range	0.07Pa to 0.26Pa
Pumping system (sputtering chamber)	TMP(1300L/s:N₂)
Gas supply systems	50 SCCM for Ar (x 9 max.) 50 SCCM for O₂ (x 1)
Substrate transfer system	Magnet coupling system
Preparation chamber	Provided as standard
Oxidation chamber	Provided as standard
Dimensions	3500W x 3000D x 2200H (mm)

For more information
Please Email Us
TEL : 978-686-7550/ FAX : 978-689-6300

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