| Sputtering
Systems |
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The SME Series is a series
of space-saving, low-cost cluster-type sputtering systems
ideal for SAW devices and compound semiconductors. The series
lets you create a highly cost-effective line tailored to your
application. |
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The SI and SIH are parallel-beam batch type and
load-lock type sputter systems. |
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SV Series batch-type sputter
systems. Series models include the SV-200 disk stamper model,
and carousel types for large-volume substrate processing |
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The Compact Sputtering System, ACS-4000-CS, is for research and development of multi layer thin films, compound materials or other devices. |
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The JSP 8000, Jsputter, is ideal for small
production or research and development of multi-layer thin film,
compound materials or other devices |
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ULVAC's MPS Ultra High Vacuum Helicon Sputter Systems were developed to enable sputtering at a pressure of 7 x 10-2 Pa, about one order of magnitude lower than the conventional sputter discharge pressure. |
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The MPS-4000-HC6 is the ideal sputtering system for deposition of MRAM/TMR multilayer films. The deposition cathode is a helicon sputtering cathode enabling low-pressure processes. |
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Our R & D Dielectric Sputtering
System consists of modular units, including a platform, load lock chamber and sputtering chamber.
Specialized in sputtering dielectrics.
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| Evaporation Systems |
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The EX/EBX Series are batch-type
high-vacuum evaporation systems |
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| Web Coating Systems |
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The EW Evaporation Web Coating Systems are deposition
systems for evaporation of metal or oxides onto continuously-wound
plastic film, paper or metal foil. |
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The SPW Sputter Web Coating Systems support
a variety of applications including deposition of optical
thin films, electrode films and ornamental films. |
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| Compound Organic/Inorganic Deposition Systems |
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VEP Series Compound Deposition Systems are designed for deposition of various organic and inorganic materials
by methods including evaporation, sputtering, plasma metallization
and evaporation metallization. |
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