Applications
- Measurements of thermal diffusivity and thermal conductivity of high-thermal conductivity sheet materials (thickness < 500 µm) such as CVD diamond and aluminum nitride
- Measurements of thermal diffusivity and thermal conductivity of various metal sheet materials (thickness > 5 µm) such as copper, nickel, and stainless steel
- Measurements of thermal diffusivity and thermal conductivity of low-thermal conductivity sheet materials (thickness < 500 µm) such as glass and resin materials
- Measurements of thermal diffusivity and thermal conductivity of polymer films such as PET and polyimide (thickness > 5 µm) and anisotropic high-thermal conductivity graphite sheets (thickness < 100 µm)
- Measurements of thermal conductivity of aluminum nitride thin films and aluminum oxide thin films (thickness 100 to 300 nm) formed on glass substrates (thickness 30 µm)
- Measurements of thermal conductivity of DLC thin films (thickness > 1 µm) formed on glass substrates (thickness 0.03 mm)
- Measurements of thermal conductivity of organic dye thin films (thickness 100 to 300 nm) formed on PET substrates (thickness 0.1 mm)
- Evaluations of target materials for sputtering
Features
- In-plane direction thermal diffusivity measurements of a broad range of sheet materials from diamond to polymers
- Suited to materials with a broad range of shapes including 3 to 500 µm thick independent sheets, films, wires, and fibers.
- Capable of measuring thermal conductivity of thin films 100 nm to 1000 nm thick formed on a substrate with the differential method * Room temperature only
